Direct laser writing of 3D metallic mid- and far-infrared wave components

Abstract A method for direct fabrication of 3D silver microstructures with high throughput on virtually any substrate is presented. The based laser-induced photoreduction ions to atoms, supported by nucleation, functionalization and a multiple exposure process. combination the novel photosensitive suspension scheme enables effective speeds up 1 cm per second, minimum structure size less than μm, resolution more 750 lines/mm resistivity 3.0 · 10 −8 Ωm. With this speed, it now possible produce conductive topographies several millimeters in length. Thus, single technology, one can fabricate photonic components characteristic spectral features ranging from mid-to far-infrared.